Silver thermally conductive paste GD460 1g >2W/m-K
GD460 - 1g silver thermally conductive paste 2.0 W/mK. The paste content of 1 gram is sufficient for 3-5 applications.
- High-performance thermally conductive paste with a conductivity of 2.0 W/mK.
- A modern formula that includes a unique composition of metal oxide compounds.
- The paste ensures stable operation of Intel, AMD, nVidia processors and other electronic circuits.
- The paste does not conduct electricity, so there is not even the slightest risk of an electrical short circuit.
- Perfectly fills the connections and micro slots between the processor and the base of the cooling system (heat sink).
- The paste should be spread very thinly for best conductivity.
- Thermal conductive paste GD460 1g according to RoHS and REACH.
- High thermal conductivity, high insulation, resistant to high temperatures, low oil separation, does not cause corrosion.
- Working principle: filling the gap between the heating element and the cooling device, increasing the contact area.
- Apply to clean surfaces (with a scraper, spoon, finger, etc.).
- Non-conductive thermal paste is used to improve heat dissipation.
SPECIFICATION
Condition
New
Viscosity
>2.4 g/Cc
Temperature
do 240 stopni C
Electrical Conductivity
No
Weight
1g
Thermal Conductivity
>2W/m-K
Laptop parts
This product is backed by a 12 months warranty.
Warranty is valid with the Warranty Card.
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